[8] Y. Cheng, A. Todri-Sanial, A. Bosio, L. Dilillo, P. Girard, A. Virazel, P. Vivet, M. Belleville, “Electromigration Alleviation Techniques for 3D Integrated Circuits,” book chapter on High Performance Computing for Big Data: Methodologies and Applications, Edited by Ch. Wang, CRC Press 2017, ISBN: 9781498783996.
[7] A. Todri-Sanial, J. Dijon, A. Maffucci, “Preface: Carbon nanotube Interconnects”, book chapter in Carbon nanotube Interconnect: Process, Design, and Applications, Edited by A. Todri-Sanial, J. Dijon, and A. Maffucci, Springer 2017, ISBN: 978-3-319-29746-0.
[6] A. Todri-Sanial, “Exploring Carbon Nanotubes for 3D Power Delivery,” book chapter in Carbon nanotube Interconnect: Process, Design, and Applications, Edited by A. Todri-Sanial, J. Dijon, and A. Maffucci, Springer 2017, ISBN: 978-3-319-29746-0.
[5] A. Todri-Sanial, “Lumped Electro-Thermal Modeling and Analysis of Carbon Nanotube Interconnects,” book chapter in Nano-CMOS and Post-CMOS Electronics: Circuits and Design Edited by S. P. Mohanty and A. Srivastava, The Institute of Engineering and Technology (IET) Vol. 2, 2016, ISBN: 978-1-84919-999-5.
[4] A. Todri-Sanial, “Exploration of Carbon Nanotubes For Efficient Power Delivery,” book chapter in Nano-CMOS and Post-CMOS Electronics: Devices and Modeling, Edited by S. P. Mohanty and A. Srivastava, The Institute of Engineering and Technology (IET), Vol.1, 2016, ISBN: 978-1-84919-997-1.
[3] A. Todri-Sanial, and C.S Tan, “Preface: Physical Design for 3D ICs,” book chapter in Physical Design for 3D ICs, Edited by A. Todri-Sanial and Ch. S. Tan, CRC PRESS 2015, ISBN: 9781498710367.
[2] A. Todri-Sanial, “Overview of Physical Design Issues for 3D ICs,” book chapter in Physical Design for 3D ICs, Edited by A. Todri-Sanial and Ch. S. Tan, CRC PRESS 2015, ISBN: 9781498710367.
[1] A. Todri-Sanial, “Design Methodology for 3D Power Delivery Networks,” book chapter in Physical Design for 3D ICs, Edited by A. Todri-Sanial and Ch. S. Tan, CRC PRESS 2015, ISBN: 9781498710367.