Interconnects

Carbon nanotubes (CNTs) due to their unique mechanical, thermal and electrical properties are being investigated as a promising candidate material replacing CMOS devices and copper, Cu interconnects. In this work, we investigate integration and design challenges of CNTs for local and global on-chip back-end-of-line interconnects. Additionally, we investigate doping of CNTs and composite Cu-CNTs for further enhancement of ampacity and resistivity of CNTs for on-chip interconnects