[T3] Tutorial on “Physical Design of 3D Integrated Circuits” at IEEE/ACM DATE 2017.
[T2] Tutorial Co-Organizer with Prof. V. Pavlidis on “Physical Design for 3D Stacked ICs” at IEEE ISCAS 2015.
[T1] Tutorial Co-Organizer with Prof. K. Chakrabarty on “Design and Test of TSV-based 3D Stacked ICs” at IEEE NEWCAS 2013.
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